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Visitors to the BOBST stand #D6 at Labelexpo Asia in Shanghai, China, 3 – 6 December 2019, can expect to hear the latest from the frontiers of labels and packaging printing and converting. Dazzling video displays will illustrate exclusive technologies that will provide exciting new opportunities for converters, driven by the digital revolution.

Packaging Day in the Heidelberg plant in Shanghai showcased an integrated packaging workflow with a focus on differentiation

Open House at Masterwork demonstrated the high quality of the finishing machines
Visitors to Pack Print International Bangkok got to witness the new design of the Speedmaster CX 75 for the first time

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