Highcon, a leading provider of digital die cutting and creasing systems, will showcase its latest innovations for mainstream corrugated packaging and display production at SuperCorrExpo 2024. Attendees can experience innovative packaging and displays produced on the upgraded Highcon Beam 2C and the Highcon Beam Writer at the Sun Automation Group booth, 1731, from September 8-12 at the Orange County Convention Center. Sun Automation is Highcon’s go-to-market partner in the US.