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Aetna Group is flying to Chicago for PACK EXPO International 2024, which will be held from 3 to 6 November at McCormick Place, North America's largest convention centre.

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Global technology, software and engineering leader Emerson will exhibit its latest Floor to CloudTM packaging solutions at PACK EXPO Chicago, November 3-6, 2024. Advancing the boundless future of automation, Emerson factory automation solutions and its Floor to Cloud approach empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.

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By Stuart Pigott & Paula Redes Sidore

In the minds of many consumers around Planet Wine vineyards are perpetually green, their grapes ripening effortlessly under clear blue skies. Of course, most interested wine drinkers realize vineyards are not Gardens of Eden, but rather at the mercy of the weather.

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Emerson Expands Automation Portfolio with Afag Feeding and Handling Solutions

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NORD offers intelligent, reliable, and cost-efficient solutions for the entire packaging process including primary packaging, secondary packaging, end-of-line packaging, and higher-level applications.

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International flexible packaging solutions specialist Korozo Group is showing its extensive portfolio of advanced innovations suitable for various food applications to Pack Expo International 2024, running this week (3-6 November) in Chicago.

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The Italian Packaging Machinery Manufacturers' Association is taking part in two important international events
Italian packaging will take centre stage at two important international events in Chicago and Dubai.

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PPC Flexible Packaging (PPC FLEX) has made a significant investment in its Buffalo Grove, Illinois, facility, expanding its cleanroom manufacturing space and enhancing production capabilities to meet the increasing demand for high-quality, sterilizable packaging for the pharmaceutical and medical device industries. The recent expansion includes a 25% increase in cleanroom manufacturing space and a doubling of the climate-controlled warehouse.

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Norden, a Coesia company and global leader in high-performance tube filling and packaging solutions, introduces new technologies designed to offer maximum flexibility, automation, and efficiency in packaging operations. The company will launch its products at Scanpack 2024 in Gothenburg, Sweden, from October 22 - 25 (booth B07.22), followed by their debut on the US market at Pack Expo International in Chicago, USA, from November 3 - 6 (booth S-2501).

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Modular Machine Eliminates Straws and Fitments, Advancing Sustainability in Food Packaging

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